@underfilladhesive1
- Name
Epoxy Chip Underfill adhesive
- Current City
Huizhou City,
- Homtetown
Guangdong
- Gender
- Birth Date
1998
- About me
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials.
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